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Unknown - 353.3 KB - MD5: 57f80cc8fd1769ffa1fbdc5f019a6a31
Unknown - 382.8 KB - MD5: 990ebcab192c51b13d5ad7700223b3ce
JPEG Image - 262.7 KB - MD5: 2c598ee036c10e1a36d88455c87caa57
JPEG Image - 255.3 KB - MD5: dd682d2c1d17f4dd3f2e22b9681582cb
Unknown - 316.3 KB - MD5: a027e35f0fde16836c65725e2244429a
Plain Text - 500 B - MD5: ad7022a18a2de2bce3d353eadba3c336
Documentation
Mar 29, 2024 - LIU Yufeng
Liu, Yufeng, 2024, "CMOS Terahertz Plasmonic Interconnect towards Tera-scale Computing", https://doi.org/10.21979/N9/V25LAK, DR-NTU (Data), V1
This project seeks to solve several scientific and practical challenges that surface plasma presents for high-performance on-chip communication. With the knowledge gained, we aim to design a novel crosstalk-free all-surface-wave I/O transceiver using low-cost CMOS technologies in...
Unknown - 295.2 KB - MD5: 35b888bf1ecad421aa645370157ea91c
Simulation result data of a passive structure
Unknown - 65.3 KB - MD5: e58a73c7d12a21e7578a578e7c0e1c2e
Simulation result data of a passive structure
Unknown - 629.7 KB - MD5: 3be2add14db170efbd2232d75eac8773
Simulation result data of a passive structure
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